Application Note

An Introduction to GaN E-HEMTs
Thermal Design for Packaged GaNPX® Devices
Measurement Techniques for High-Speed GaN E-HEMTs
Design considerations of paralleled GaN HEMT
SPICE model for GaN HEMT usage guidelines and example
Modeling Thermal Behavior of GaNPX® and PDFN packages Using RC Thermal SPICE Models
GaN Switching Loss Simulation Using LTSpice
PCB Layout Considerations with GaN E-HEMTs
EZDriveTM Solution for GaN Systems E-HEMTs
Soldering Recommendations for GaNPX® and PDFN Packaged Devices
Gate Driver Design with GaN E-HEMTs